Semiconductor method of making electrical connection between an electrically conductive line and a node location, and integrated circuitry

ABSTRACT

A semiconductor processing method of making electrical connection between an electrically conductive line and a node location includes, a) forming an electrically conductive line over a substrate, the substrate having an outwardly exposed silicon containing node location to which electrical connection is to be made, the line having an outer portion and an inner portion, the inner portion laterally extending outward from the outer portion and having an outwardly exposed portion, the inner portion having a terminus adjacent the node location, and b) electrically connecting the extending inner portion with the node location. An integrated circuit is also described. The integrated circuit includes a semiconductor substrate, a node location on the substrate, and a conductive line over the substrate which is in electrical communication with the node location. The conductive line includes an outer portion and an inner portion. The outer portion has a terminus and the inner portion extends laterally away from the outer portion terminus and generally toward the node location. The inner portion is in electrical communication with the node location.

This patent resulted from a continuation application of U.S. patent application Ser. No. 08/699,828, filed Aug. 20, 1996, entitled “Semiconductor Method of Making Electrical Connection Between an Electrically Conductive Line and a Node Location, and Integrated Circuitry”, naming Monte Manning as inventor, and which is now U.S. Pat. No. 5,869,391 the disclosure of which is incorporated by reference.

TECHNICAL FIELD

This invention relates to an integrated circuit and semiconductor processing methods of making electrical connection between an electrically conductive line and a node location.

BACKGROUND OF THE INVENTION

Single semiconductor devices are grouped into integrated circuits, which in turn are further densified into large scale integrated semiconductor systems. The trend in semiconductor integrated circuitry fabrication continues to involve a decrease in the size of individual structures. However, this has been accompanied by an increase in the complexity and number of such structures aggregated on a single semiconductor integrated chip.

One type of integrated circuitry comprises memory circuitry. This invention arose out of problems or challenges inherent in producing a particular type of memory circuitry, namely static random access memory (SRAMs). Such circuitry typically interconnects a gate of one transistor device to a diffusion area of another transistor device in a semiconductor substrate. One typical prior art method of accomplishing such fabrication and interconnection is described with reference to FIGS. 1-4.

FIG. 1 illustrates a semiconductor wafer fragment 10 comprised of a bulk substrate region 12 and field oxide regions 13. A gate oxide layer 14 overlies silicon substrate 12. A polysilicon layer 15 is provided over field oxide regions 13 and gate oxide layer 14. Such will be utilized for fabrication of a transistor gate line of associated SRAM circuitry. A layer 16 of photoresist is provided atop the substrate, and provided with an opening 17 therein.

Referring to FIG. 2, a contact opening 18 to bulk substrate 12 has been etched through polysilicon layer 15 and gate oxide layer 14. A desired diffusion region 20 is provided as shown. Then, the photoresist layer 16 of FIG. 1 is stripped.

Referring to FIG. 3, a subsequent polysilicon layer 22 is deposited over first polysilicon layer 15 and to within contact opening 18.

Referring to FIG. 4, layers 22 and 15 are patterned and etched to produce the illustrated transistor gate line 24 which extends over and ohmically connects with diffusion region 20.

It would be desirable to improve upon such a construction and method for producing such a construction. The artisan will also appreciate applicability of the invention to fabrication of constructions other than SRAM circuitry.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below with reference to the following accompanying drawings.

FIG. 1 is a diagrammatic sectional view of a prior art semiconductor wafer fragment at one prior art processing step, and is discussed in the “Background” section above.

FIG. 2 is a view of the FIG. 1 prior art wafer fragment at a prior art processing step subsequent to that shown by FIG. 1.

FIG. 3 is a view of the FIG. 1 prior art wafer fragment at a prior art processing step subsequent to that shown by FIG. 2.

FIG. 4 is a view of the FIG. 1 prior art wafer fragment at a prior art processing step subsequent to that shown by FIG. 3.

FIG. 5 is a diagrammatic sectional view of a semiconductor wafer fragment at one processing step in accordance with the invention.

FIG. 6 is a view of the FIG. 5 wafer fragment at a processing step subsequent to that shown in FIG. 5.

FIG. 7 is a view of the FIG. 5 wafer fragment at a processing step subsequent to that shown in FIG. 6.

FIG. 8 is a view of the FIG. 5 wafer fragment at a processing step subsequent to that shown in FIG. 7.

FIG. 9 is a view of the FIG. 5 wafer fragment at a processing step subsequent to that shown in FIG. 8.

FIG. 10 is a view of the FIG. 5 wafer fragment at a processing step subsequent to that shown in FIG. 9.

FIG. 11 is a view of the FIG. 5 wafer fragment at a processing step subsequent to that shown in FIG. 10.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).

In accordance with one aspect of the invention, a semiconductor processing method of making electrical connection between an electrically conductive line and a node location comprises the steps of:

providing a substrate having an outer dielectric surface and a node location to which electrical connection is to be made;

forming a first layer over the outer dielectric surface and the node location;

forming a patterned masking layer over the first layer laterally adjacent the node location;

forming a second layer over the first layer and the patterned masking layer;

patterning and etching the first and second layers and forming an electrically conductive line therefrom, the second layer of the line having a terminus positioned over the patterned masking layer, the first layer of the line forming an extension which extends laterally outward relative to the second layer terminus; and

electrically connecting the first layer extension with the node location.

In accordance with another aspect of the invention, a semiconductor processing method of making electrical connection between an electrically conductive line and a node location comprises the steps of:

forming an electrically conductive line over a substrate, the substrate having an outwardly exposed silicon containing node location to which electrical connection is to be made, the line having an outer portion and an inner portion, the inner portion laterally extending outward from the outer portion and having an outwardly exposed silicon containing portion, the inner portion having a terminus adjacent the node location;

forming a metal layer over the exposed inner portion and the exposed node location; and

exposing the substrate to conditions effective to form an electrically conductive metal silicide interconnect between the extending inner portion and the node location.

In accordance with another aspect of the invention, an integrated circuit comprises:

a semiconductor substrate;

a node location on the substrate; and

a conductive line over the substrate in electrical communication with the node location, the conductive line including an outer portion and an inner portion, the outer portion having a terminus, the inner portion extending laterally away from the outer portion terminus generally toward and in electrical communication with the node location.

Referring to FIGS. 5-11, and first to FIG. 5, a semiconductor wafer fragment in accordance with the invention is indicated generally with reference numeral 25. Such comprises a bulk semiconductor substrate 26 (preferably monocrystalline silicon). Other suitable substrate material such as silicon-on-insulator (SOI) may be utilized in connection with the invention. A field oxide region 28 and gate oxide layers 30 are formed or provided. The field oxide region 28 defines an outer dielectric surface 27 of substrate 26. A node location is indicated generally by reference numeral 32 and defines some location to which electrical connection is to be made. A first layer 34 is formed or provided over the outer dielectric surface and node location, and preferably comprises conductively doped polysilicon. Preferably, first layer 34 is provided to a thickness of around 700 Angstroms, although a range of thicknesses between about 100 Angstroms to 2000 Angstroms would suffice. First layer 34 may be electrically conductive as formed before a subsequent patterning and etching step, or it may be rendered conductive after provision on dielectric surface 27 as will become apparent below. An etch stop or masking layer 36 is formed over first layer 34 and overlies field oxide region 28 and gate oxide layers 30. A preferred material for etch stop layer 36 is a deposited oxide such as SiO₂, and more preferably a TEOS layer having a thickness of about 100 Angstroms. However, other thicknesses from between about 20 Angstroms to 1000 Angstroms will suffice. Other exemplary materials include nitride, aluminum oxide, TiO_(x), etc.

Referring to FIG. 6, etch stop layer 36 is patterned and etched to define a patterned etch stop or masking layer (hereinafter designated by referenced numeral 36) to cover desired substrate active areas and leave desired substrate field oxide areas exposed. As shown, patterned etch stop layer 36 is positioned proximate, or laterally adjacent node location 32. The etched layer 36 serves as an etch stop for a portion of the underlying first layer 34 as will be explained below.

Referring to FIG. 7, a second layer 38 is formed over first layer 34 and the patterned etch stop layer 36. Preferably, second layer 38 comprises polysilicon and includes a conductivity enhancing impurity which renders it electrically conductive immediately upon its formation. Layer 38 is preferably formed to a thickness of between about 500 Angstroms to 10,000 Angstroms. More preferably, layer 38 is formed to a thickness of between about 1000 Angstroms to 2000 Angstroms. Most preferably, layer 38 is about 1500 Angstroms thick.

In the preferred embodiment, layers 38 and 34 constitute part of a conductive line and are accordingly electrically conductive. First layer 34 can be rendered electrically conductive in a number of ways. For example, first layer 34 may be in situ doped with a conductivity enhancing impurity during deposition thereby being electrically conductive upon its formation. Alternately, it can be doped after its deposition. Further, etch stop layer 36 can be doped with a conductivity enhancing impurity, with out diffusion therefrom rendering first layer 34 electrically conductive after provision on the outer dielectric surface and node location. Doping layer 36 as just described creates what is commonly referred to as “doped glass”. Doped glass has an additional advantage which stems from its etch rate which is much higher than thermally grown gate oxide. Thus, it is much more easily removed in subsequent patterning and etching steps described below. Other doping options for first layer 34 include that second layer 38 can be provided with sufficient conductivity enhancing impurity, such as phosphorus, that out diffusion therefrom renders first layer 34 electrically conductive. Further, that portion of first layer 34 which generally underlies patterned etch stop layer 36 can be rendered electrically conductive by lateral diffusion of a conductivity enhancing impurity provided during a subsequent source/drain implant described below.

Referring to FIGS. 8 and 9, first and second layers 34, 38 are patterned and etched to form an electrically conductive line 40 overlying bulk substrate 26, field oxide 28, and gate dielectric layer 30. The etch also further defines node location 32. As shown, line 40 has an outer portion 42 in the form of layer 38, and has an outer portion or second layer terminus 44 positioned over etch stop layer 36. Line 40 also includes an inner portion in the form of layer 34 having an extension 46 which extends laterally outwardly from outer portion 42 and more specifically outer portion terminus 44. Inner portion 34 includes an inner portion terminus 48 which is located adjacent node location 32. Inner portion terminus 48 directly overlies gate oxide and hence is not yet electrically connected to or with node location 32.

Referring to FIGS. 8 and 9, an insulating material is deposited and anisotropically etched or over etched to form a sidewall spacer 50 over outer portion terminus 44. Such etch also preferably removes that portion of gate dielectric layer 30 which overlies node location 32 and which is not itself covered by etch stop layer 36 and extension 46. Such etch outwardly exposes silicon containing node location 32. Preferably spacer 50 has a lateral width dimension from between around 50 Angstroms to 3000 Angstroms. Even more preferably, spacer 50 has a lateral width dimension of around 1200 Angstroms. Such overetch is preferably conducted to a point of removing the exposed portion of etch stop layer 36 which is laterally adjacent outer portion terminus 44 and not covered by sidewall spacer 50. Such overetch exposes at least some of the underlying inner portion 34/extension 46 as shown. Such may also leave a spacer 45 which is desirably not entirely covering the inner portion terminus 48. Preferably, first layer 34 is of a sufficient thickness (about 700 Angstroms) so that it retains a remnant thickness after the anisotropic etch of around 300 Angstroms to 400 Angstroms. This is because the anisotropic etch or overetch typically consumes around 100 Angstroms to 300 Angstroms of the first layer. Such thickness is desirable for providing a sufficient amount of polysilicon for a salicide reaction described below. Additionally, first layer 34 is suitably dimensioned to allow spacer 45 to be formed to a preferred height on at least a portion thereof. Such preferred spacer height is less than around 100 Angstroms and facilitates formation of a salicide bridge described below in conjunction with FIG. 10.

Referring still to FIGS. 8 and 9, a desired thickness of layer 36 is one which blocks the etch of the first and second layers 34, 38 (FIG. 8) so that the underlying portion of first layer 34 is protected during the etch described in conjunction with FIG. 8. The desired thickness of layer 36 is also one which minimizes the amount of overetch necessary to clear the exposed portion of etch stop layer 36 overlying first layer 34 and described in conjunction with FIG. 9. Minimizing the amount of overetch required to clear the exposed portion of etch stop layer 36 also minimizes or reduces the etch into that portion of oxide layer 28 which is not covered. Alternatively, though less preferred, etch stop layer 36 may be provided in the form of a heavily doped (e.g. phosphorus doped) PECVD oxide having a high etch rate in HF. If such is the case, then following the first and second layer etch of FIG. 8, a HF dip can be performed to remove the desired portions of the etch stop layer with minimal effect on the underlying oxide regions or layers. At this point, conductivity enhancing impurity can be provided into substrate 26 to form a source/drain region 33 adjacent inner portion terminus 48. Other options for forming region 33 include providing conductivity enhancing impurity into the substrate prior to deposition of first layer 34 as by a masked implant step. Alternatively, conductivity enhancing impurity can be provided into the substrate after deposition of first layer 34 but before deposition of etch stop layer 36.

With respect to layers 34 and 38, the sum of the thicknesses of such layers is preferably one which provides a stable work function for the devices. Typically, a thickness of around 800 Angstroms is sufficient.

Referring to FIG. 10, a conductive refractory metal layer 52 is formed over the exposed inner portion 34/extension 46 and the exposed node location 32, as well as outer portion 42 of conductive line 40. Preferably, layer 52 comprises titanium which is formed to a thickness of between 50 Angstroms and 1000 Angstroms. Even more preferably, layer 52 is formed to a thickness of around 200 Angstroms. Metal layer 52 is used to electrically connect, with node location 32, the portion of inner portion 46 which extends laterally away from outer portion terminus 44. Metals such as nickel, tungsten, platinum, cobalt and other refractory metals may also be used to form layer 52.

Referring to FIG. 11, wafer fragment 25, and accordingly metal layer 52 (FIG. 10), are heated and accordingly exposed to conditions effective to react with the exposed silicon areas and form an electrically conductive interconnecting silicide bridge 54 between the exposed inner portion 34/extension 46 and node location 32. A conventional subsequent selective etch can be used to remove the unreacted metal without attacking the silicide. At this point, if the above-referenced source/drain region was not provided, it could be by provision of conductivity enhancing impurity into the substrate.

As an alternative to forming a silicide layer 56 atop second layer 38, such layer may be capped with a suitable oxide for insulating it from the salicidation process which forms interconnecting silicide bridge 54.

The above-described process essentially provides a conducting line-node interconnecting tongue which extends away from field oxide region 28 and toward node location 32. The conducting tongue or inner portion 46 is in electrical communication with node location 32 by virtue of the interconnecting silicide bridge 54. The conducting tongue forms part of a conductive line 40 which electrically interconnects node location 32 with a gate of another transistor.

Forming a contact between devices as described above eliminates sensitivity to the formation of native oxides over the node location to which electrical connection is being made. Because of this, higher yields are possible. Additionally, incorporation of the above-described contact into SRAM cells provides a smaller cell since the tongue requires less area than the typical buried contact. This is because buried contacts of the prior art utilize an enclosure in polysilicon around the buried contact which adds to the required area. Further, the tongue may be placed within an alignment tolerance of adjacent gate polysilicon areas whereas a buried contact must be spaced away by a distance determined by the resolution of the lithography. This is typically a larger distance than the misalignment tolerance.

In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents. 

What is claimed is:
 1. A semiconductor processing method of making electrical connection between an electrically conductive line and a node location comprising: providing a substrate having an outer dielectric surface and a node location to which electrical connection is to be made; forming a first layer over the outer dielectric surface and the node location; forming a masking layer over the first layer and patterning the masking layer, to overlie a portion of the first layer laterally adjacent the node location and expose other portions of the first layer; forming a second layer over the first layer and the patterned masking layer and in electrical connection with the exposed portions of the first layer; after forming the second layer, patterning the first and second layers to form an electrically conductive line, the second layer of the line having a second layer terminus positioned over the patterned masking layer, the first layer of the line having an extension which extends laterally outward, relative to the second layer terminus, underlying the patterned masking layer to a first layer terminus adjacent the node location; and after forming the electrically conductive line, electrically connecting the first layer extension, the second layer, and the node location with conductive material formed thereover, the conductive material formed into a silicide bridge for interconnecting the first layer extension, the second layer and the node.
 2. The method of claim 1 wherein the first layer comprises polysilicon which is electrically conductive prior to patterning and etching.
 3. The method of claim 1, wherein the first layer comprises polysilicon which is rendered electrically conductive after patterning and etching.
 4. The method of claim 1, wherein the second layer is electrically conductive comprising a conductivity enhancing impurity, the first layer comprises polysilicon and is rendered electrically conductive substantially by out diffusion of conductivity enhancing impurity from the second layer.
 5. The method of claim 1, wherein forming the masking layer comprises forming the masking layer doped with a conductivity enhancing impurity, the first layer comprises polysilicon and is rendered electrically conductive by out diffusion of conductivity enhancing impurity from the masking layer.
 6. The method of claim 1 further comprising after patterning the first and second layers, removing at least some of the masking layer laterally adjacent the second layer terminus and adjacent the node location to expose a portion of the first layer.
 7. The method of claim 1, further comprising after patterning the first and second layers: depositing an insulating material over the second layer terminus and the first layer extension; and anisotropically etching the insulating material to form a sidewall spacer over the second layer terminus wherein the etching also removes at least some of the masking layer to expose a portion of the first layer; and wherein electrically connecting comprises forming a silicide bridge interconnecting the first layer's exposed portion and the node location.
 8. The method of claim 1, wherein electrically connecting comprises forming a refractory metal layer over a portion of the first layer extension and the node location and exposing the substrate to conditions effective to form a silicide connecting bridge therebetween.
 9. The method of claim 1, wherein prior to said electrically connecting, exposing a portion of the first layer extension by removing some of the overlying masking layer, and forming a refractory metal layer over the exposed first layer extension and the node location.
 10. The method of claim 1 wherein the second layer contacts the first layer.
 11. The method of claim 1 wherein the outer portion contacts the inner portion.
 12. A semiconductor processing method comprising: forming an electrically conductive interconnect line over a substrate, the substrate having an outwardly exposed silicon containing node location to which electrical connection is to be made, the interconnect line having an outer portion and an inner portion, the outer portion and the inner portion electrically interconnecting with one another along a common segment of their lengths, the electrically interconnecting along the common segment being provided by removing portions of a masking layer formed overlying the inner portion before the outer portion is formed, the inner portion comprising an outwardly exposed silicon containing portion having an inner portion terminus adjacent the node location; forming a metal layer over the exposed inner portion and the exposed node location; and exposing the substrate to conditions effective to form an electrically conductive metal silicide interconnect between the extending inner portion and the node location, both the outer and inner portions being in electrical communication with the node location through said metal silicide interconnect.
 13. The method of claim 12, wherein forming the inner portion having an outwardly exposed silicon containing portion comprises: forming the masking layer atop the inner portion; and removing at least a part of the masking layer to expose the outwardly exposed silicon containing portion.
 14. The method of claim 12, wherein the outer portion has an outer portion terminus, the inner portion having an outwardly exposed silicon containing portion is formed by forming the masking layer atop the inner portion; forming a sidewall spacer on the outer portion terminus, the sidewall spacer covering at least a part of the masking layer; and removing an amount of the masking layer which is not covered by the sidewall spacer to expose the exposed silicon containing portion.
 15. The method of claim 12, wherein the outer portion has an outer portion terminus, the inner portion having an outwardly exposed silicon containing portion formed by: forming the masking layer atop the inner portion; forming a sidewall spacer on the outer portion terminus, the sidewall spacer covering at least part of the masking layer; and removing an amount of the masking layer which is not covered by the sidewall spacer to expose the silicon containing portion of the inner portion; and further wherein the steps of forming a sidewall spacer on the outer portion terminus and removing an amount of the masking layer which is not covered by the sidewall spacer comprise forming an insulating material over at least part of the conductive line outer portion and part of the masking layer; and anisotropically etching the insulating material to a degree sufficient to leave a sidewall spacer on at least most of the outer portion terminus, the etch serving to remove a part of the masking layer which is not covered by the sidewall spacer.
 16. The method of claim 12, wherein the outer and inner portions have respective thicknesses which are different from one another.
 17. The method of claim 12, wherein the outer and inner portions have respective thicknesses which are different from one another, the outer portion thickness being greater than the inner portion thickness.
 18. The method of claim 12, wherein the outer and inner portions comprise polysilicon.
 19. The method of claim 12, wherein the outer and inner portions comprise polysilicon, the outer portion contains a conductivity enhancing impurity and the inner portion is rendered electrically conductive substantially by out diffusion of conductivity enhancing impurity from the outer portion.
 20. The method of claim 12, wherein the outer and inner portions comprise polysilicon, and the inner portion having an outwardly exposed silicon containing portion formed by: forming the masking layer atop the inner portion, the masking layer containing a conductivity enhancing impurity; removing at least a part of the masking layer to expose the outwardly exposed silicon containing portion, and rendering the inner portion electrically conductive by out diffusion of conductivity enhancing impurity from the masking layer.
 21. The method of claim 12, further comprising forming a conductive diffusion region in the substrate adjacent the inner portion terminus, the conductive diffusion region comprising the node location.
 22. A semiconductor processing method comprising: forming an electrically conductive interconnect line over a substrate, the substrate having an outwardly exposed silicon containing node location to which electrical connection is to be made, the interconnect line having an outer portion, an inner portion and a masking layer disposed between a portion of the inner and outer portions, the inner and outer portions in electrical connection with one another proximate the node location, the inner portion having a region laterally extending outward from the outer portion, an upper surface thereof overlaid by the masking layer, the region of the inner portion having a terminus adjacent the node location, the terminus having an outwardly exposed portion; and electrically connecting the extending region of the inner portion with the node location.
 23. The method of claim 22, wherein the step of electrically connecting the extending inner portion with the node location comprises forming a silicide interconnecting bridge therebetween.
 24. A semiconductor processing method of making an electrical interconnect comprising: providing a substrate having an outer dielectric surface and a node location to which electrical connection is to be made; forming a first layer over the outer dielectric surface and the node location; forming a masking layer over the first layer proximate the node location; prior to forming a second layer, patterning the masking layer, forming the second layer over the first layer and the patterned masking layer; patterning the first and second layers with a common masking and a common etching step to form an electrically conductive interconnect line and expose the node location, the line having an outer portion with an outer portion terminus over the masking layer, and an inner portion comprising the masking layer, the inner portion laterally extending outward from the outer portion having an inner portion terminus adjacent the node location; depositing an insulating material over the substrate; conducting an anisotropic spacer etch of the insulating material to leave a sidewall spacer over at least most of the outer portion terminus and to remove at least some of the masking layer to expose at least some of the inner portion; forming a refractory metal layer over the exposed inner portion and the exposed node location; and exposing the substrate to conditions effective to form an electrically conductive interconnect between the exposed inner portion and the node location.
 25. The method of claim 24, wherein the masking layer contains conductivity enhancing impurity and the first layer is rendered electrically conductive substantially by out diffusion of conductivity enhancing impurity from the masking layer.
 26. The method of claim 24, wherein the second layer contains a conductivity enhancing impurity and the first layer is rendered electrically conductive substantially by out diffusion of conductivity enhancing impurity from the second layer.
 27. The method of claim 24, further comprising providing conductivity enhancing impurity into the substrate at the node location, lateral diffusion of which rendering the inner portion of the conductive line at least more electrically conductive than before the conductivity enhancing impurity was provided. 